A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...
With more than five 3.5D products in development, a majority of Broadcom’s consumer AI customers have adopted the 3.5D XDSiP platform technology with production shipments starting February 2026. For ...
Essentially the stacked L3 cache chip, and the surrounding structural silicon, act as insulation for the cores, limiting the heat exchanging properties of your CPU cooler. That's why first-gen 3D ...
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the ...