Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...

Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...

Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a ...

A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...

The Biden administration announced a sweeping set of export controls on chip-manufacturing equipment, memory, and software ...

One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the ...

A teardown reveals the Zen 5 CCD and the gold 3D V-Cache stack. AMD's new Ryzen 7 9800X3D processor is here, and now a chip teardown has been performed with some truly beautiful results ...