Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a ...
A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...
“Form factor is one big consideration,” says Sooyong Kim, senior product manager in 3D-IC Chip Package Systems and Multiphysics at ANSYS. “They want to make things smaller. Mobile was one of the ...
Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...
With more than five 3.5D products in development, a majority of Broadcom’s consumer AI customers have adopted the 3.5D XDSiP platform technology with production shipments starting February 2026. For ...
A new challenge is on the horizon, and it’s one that could have some interesting consequences for chip design — structural integrity. Ever since the introduction of finFETs and 3D NAND, the lines have ...
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the ...
Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...
12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D ... package structure for each project in the early ...