Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a ...
Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...
Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...
A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...
With more than five 3.5D products in development, a majority of Broadcom’s consumer AI customers have adopted the 3.5D XDSiP platform technology with production shipments starting February 2026. For ...
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the ...