Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...
“Form factor is one big consideration,” says Sooyong Kim, senior product manager in 3D-IC Chip Package Systems and Multiphysics at ANSYS. “They want to make things smaller. Mobile was one of the ...
With more than five 3.5D products in development, a majority of Broadcom’s consumer AI customers have adopted the 3.5D XDSiP platform technology with production shipments starting February 2026. For ...
Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...
12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D ... package structure for each project in the early ...