Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a ...
A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of ...
Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...
In some cases, these advanced packages actually may turn out to be the lowest-cost options. With stacked die [1], each ... You need a 3D electromagnetic tool to analyze the long traces on the ...
Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the ...
12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D ... package structure for each project in the early ...