“Form factor is one big consideration,” says Sooyong Kim, senior product manager in 3D-IC Chip Package Systems and Multiphysics at ANSYS. “They want to make things smaller. Mobile was one of the ...
Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...
Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...
12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D ... package structure for each project in the early ...