Since 3D-interfaces [1],[4],[6]-[9] communicate close proximity ... “A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme for 3-D-Stacked System in a Package, ...
Nvidia provides an example of finding hot spots and rectifying electromagnetic issues faster and more easily in a 3D-stacked chip design when viewed from a 3-dimensional perspective. A great ...
With more than five 3.5D products in development, a majority of Broadcom’s consumer AI customers have adopted the 3.5D XDSiP platform technology with production shipments starting February 2026. For ...