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电子工程专辑
1 个月
今晚7点见!AIGC时代:探索Chiplet互联趋势与Die-to-Die接口技术
随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
Yahoo Finance
18 天
Pre-Registration Opens for Chiplet Summit
Chiplet Summit also features innovative products from industry leaders such as Synopsys, Alphawave Semi, Arm, Teradyne, Cadence, Keysight, Open Compute Project, Achronix, Siemens EDA, and SK hynix.
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