随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
Chiplet Summit opens pre-registration today for its third annual event on January 21-23 at the Santa Clara Convention Center. All major chip makers have adopted chiplets as their way to produce ...
Chiplet Summit also features innovative products from industry leaders such as Synopsys, Alphawave Semi, Arm, Teradyne, Cadence, Keysight, Open Compute Project, Achronix, Siemens EDA, and SK hynix.