随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小 ...
小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小芯片的插槽规格,以保持对市场的控制; 而众多初创公司、系统公司和政府机构则倡导自上而下的方法 ...
GPU也是D2D方式外接,算力有4TFLOPS。Chiplet可以灵活分割,针对网关领域,无需外接GPU和NPU。座舱领域也可以不需要NPU,或者很小规模的NPU即可。
has selected Alphawave Semi’s multiprotocol I/O Connectivity Chiplets for their next-generation product REBEL. This collaboration will enable Rebellions to deliver unprecedented bandwidth for its ...
Alphawave Semi’s Advanced I/O chiplet integrates its PCIe 6.0, CXL 3.1, and Ethernet subsystems with UCIe 2.0 die-to-die ...
“The core technology has already been proven in the MEMS market and eliminates expensive interposers, and we are planning on running test Chiplet packaging in 2025,” said Digitho CEO and founder, ...
This is being described by the company as a significant leap forward in that it has successfully prototyped, designed, and taped out the industry's first system chiplet – which integrates processors, ...
Open Compute Project Foundation (OCP), a non-profit organization bringing hyperscale innovations to all, has taken the next important step in establishing an Open Chiplet Economy with the opening of ...
AMD was rumored to be looking at a chiplet design for the RDNA 4 flagship, before seemingly canning it (and as we know, Team ...