随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小 ...
这家IP巨头正在逐步揭开其设计蓝图,以迎接当今半导体领域最令人兴奋的机会之一。 至关重要的是,Arm要确保其计算构建模块在多die硅平台上占有一席之地,无论是CPU chiplet还是定制的特定应用chiplet。因此,Arm正在与芯片设计公司和半导体IP供应商建立战略 ...
GPU也是D2D方式外接,算力有4TFLOPS。Chiplet可以灵活分割,针对网关领域,无需外接GPU和NPU。座舱领域也可以不需要NPU,或者很小规模的NPU即可。
has selected Alphawave Semi’s multiprotocol I/O Connectivity Chiplets for their next-generation product REBEL. This collaboration will enable Rebellions to deliver unprecedented bandwidth for its ...
Alphawave Semi’s Advanced I/O chiplet integrates its PCIe 6.0, CXL 3.1, and Ethernet subsystems with UCIe 2.0 die-to-die ...
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...
Alphawave Semi, an IP and contract chip designer, has developed the industry's first 3nm UCIe chiplet that enables die-to-die ...
A new technical paper titled “Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception” was published by researchers at UC Irvine. “We study the application ...
This is being described by the company as a significant leap forward in that it has successfully prototyped, designed, and taped out the industry's first system chiplet – which integrates processors, ...
Open Compute Project Foundation (OCP), a non-profit organization bringing hyperscale innovations to all, has taken the next important step in establishing an Open Chiplet Economy with the opening of ...