从2020年开始,随着AI计算的大爆发和云计算规模持续、快速地增长,企业级用户的需求也在快速攀升。即使在2023年,企业级处理器已经实现单路最高128核256线程的规模,但面对无尽的计算需求,企业级用户依旧强烈渴求更快、更高效的产品。为了顺应这种趋势 ...
在快速发展的半导体领域,小芯片技术正在成为一种开创性的方法,解决传统单片系统级芯片(SoC)设计面临的许多挑战。随着摩尔定律的放缓,半导体行业正在寻求创新的解决方案,以提高性能和功能,而不只是增加晶体管密度。小芯片提供了有前途的前进道路,在芯片设计和 ...
The chipmaker is going after Intel in technical computing workloads with a refreshed lineup of EPYC CPUs that use 3D chiplet technology to triple the L3 cache, which will speed up performance ...
AMD EPYC 7003 Series processors with 3-D V-Cache ... than 200X the interconnect densities compared with on-package 2-D chiplet interconnects, and more than 15X the interconnect densities of ...
For reference, first-gen Epyc lacked a distinct I/O die ... Perhaps the bigger question is where AMD will take its chiplet architecture next. Looking at AMD's 128-core Turin processors, there's ...
As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density, as de ...
The reason why is that the 7945HX3D and Strix Halo are chiplet-based—think desktop Ryzen ... plus three server-grade Epyc chips. So for anyone wanting to boost CPU performance in scientific ...