小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小 ...
小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小芯片的插槽规格,以保持对市场的控制; 而众多初创公司、系统公司和政府机构则倡导自上而下的方法 ...
随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
英特尔的3D封装技术Foveros的特点在于,它能在处理器制造过程中以垂直方式堆叠计算模块,而非传统的水平方式。此外,Foveros技术使得英特尔及其 ...
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...
A new technical paper titled “Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception” was published by researchers at UC Irvine. “We study the application ...
This is being described by the company as a significant leap forward in that it has successfully prototyped, designed, and taped out the industry's first system chiplet – which integrates processors, ...