英特尔的3D封装技术Foveros的特点在于,它能在处理器制造过程中以垂直方式堆叠计算模块,而非传统的水平方式。此外,Foveros技术使得英特尔及其 ...
今天我把同事正在用的笔记本电脑给拆了,发现它里面的处理器居然采用了多核异构的chiplet先进封装设计。 联想ThinkBook 14 G6+ IMH笔记本电脑是该公司最新推出的AI PC系列产品。该产品专为商务用户设计,集性能、便携性和生产力于一身。它提供多种型号,每种 ...
11月11日消息,截止13:50,Chiplet概念板块走强,华大九天、通富微电、晶方科技涨停,华天科技、光力科技、长电科技等个股涨幅居前。
Open Compute Project Foundation (OCP), a non-profit organization bringing hyperscale innovations to all, has taken the next important step in establishing an Open Chiplet Economy with the opening of ...
A technical paper titled “RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures” was published by researchers at ETH Zurich and University of Bologna. “Chiplet ...
AMD was rumored to be looking at a chiplet design for the RDNA 4 flagship, before seemingly canning it (and as we know, Team ...
The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...
One way or another, we’re likely to see chiplet designs for consumer GPUs in the future, perhaps from AMD, Nvidia, and indeed Intel as evidenced by the patent here. There are broader worries ...
SEOUL, South Korea, Nov. 11, 2024 -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced their collaboration with Synopsys to develop a ...
SEMIFIVE's HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost, optimize performance, and enable development flexibility. This platform will ...
SAN DIEGO, November 21, 2024--(BUSINESS WIRE)--Chiplet Summit opens pre-registration today for its third annual event on January 21-23 at the Santa Clara Convention Center. All major chip makers ...
A new technical paper titled “High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was published by researchers at TSMC. “The ...