Open Compute Project Foundation (OCP), a non-profit organization bringing hyperscale innovations to all, has taken the next important step in establishing an Open Chiplet Economy with the opening of ...
A technical paper titled “RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures” was published by researchers at ETH Zurich and University of Bologna. “Chiplet ...
The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...
One way or another, we’re likely to see chiplet designs for consumer GPUs in the future, perhaps from AMD, Nvidia, and indeed Intel as evidenced by the patent here. There are broader worries ...
SEOUL, South Korea, Nov. 11, 2024 -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced their collaboration with Synopsys to develop a ...
SEMIFIVE's HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost, optimize performance, and enable development flexibility. This platform will ...
SAN DIEGO, November 21, 2024--(BUSINESS WIRE)--Chiplet Summit opens pre-registration today for its third annual event on January 21-23 at the Santa Clara Convention Center. All major chip makers ...
A new technical paper titled “High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was published by researchers at TSMC. “The ...