随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小 ...
小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小芯片的插槽规格,以保持对市场的控制; 而众多初创公司、系统公司和政府机构则倡导自上而下的方法 ...
英特尔的3D封装技术Foveros的特点在于,它能在处理器制造过程中以垂直方式堆叠计算模块,而非传统的水平方式。此外,Foveros技术使得英特尔及其 ...
11月11日消息,截止13:50,Chiplet概念板块走强,华大九天、通富微电、晶方科技涨停,华天科技、光力科技、长电科技等个股涨幅居前。
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...
SAN RAMON, CA, UNITED STATES, December 5, 2024 -- YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution. Currently advanced packaging ...
They have also become a major venue for increasing transistor density as Moore’s Law slows down. IDTechEx report “Chiplet Technology 2025-2035: Technology, Opportunities, Applications” asserts that ...
“The core technology has already been proven in the MEMS market and eliminates expensive interposers, and we are planning on running test Chiplet packaging in 2025,” said Digitho CEO and founder, ...
A new technical paper titled “Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception” was published by researchers at UC Irvine. “We study the application ...
Open Compute Project Foundation (OCP), a non-profit organization bringing hyperscale innovations to all, has taken the next important step in establishing an Open Chiplet Economy with the opening of ...