Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...
SAN RAMON, CA, UNITED STATES, December 5, 2024 -- YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution. Currently advanced packaging ...
They have also become a major venue for increasing transistor density as Moore’s Law slows down. IDTechEx report “Chiplet Technology 2025-2035: Technology, Opportunities, Applications” asserts that ...
“The core technology has already been proven in the MEMS market and eliminates expensive interposers, and we are planning on running test Chiplet packaging in 2025,” said Digitho CEO and founder, ...
A new technical paper titled “Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception” was published by researchers at UC Irvine. “We study the application ...
Open Compute Project Foundation (OCP), a non-profit organization bringing hyperscale innovations to all, has taken the next important step in establishing an Open Chiplet Economy with the opening of ...