小芯片(Chiplet)技术的推动下,芯片设计领域出现了两种方法,自上而下和自下而上,逐渐成为两条分支。 大型垂直整合企业倾向于严格定义小 ...
随着半导体制程不断逼近物理极限,越来越多的芯片厂商为了提升芯片性能和效率开始使用Chiplet技术,将多个满足特定功能的芯粒单元通过Die-to-Die互联技术与底层基础芯片封装在一起,形成一个系统级芯片。 在单个芯片内部,基于Chiplet架构的IO Die、Die-to-Die ...
英特尔的3D封装技术Foveros的特点在于,它能在处理器制造过程中以垂直方式堆叠计算模块,而非传统的水平方式。此外,Foveros技术使得英特尔及其 ...
A new technical paper titled “Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception” was published by researchers at UC Irvine. “We study the application ...
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet ...
This is being described by the company as a significant leap forward in that it has successfully prototyped, designed, and taped out the industry's first system chiplet – which integrates processors, ...