Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day ...

Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a ...

Germany-based adhesive technology supplier Panacol has launched Elecolit 3648, a conductive adhesive for ... which is important for the heat-sensitive OPV materials,” Lena Reincke, Panacol ...

121-22 A/B is a competitively priced, easy to use, two part, room temperature curing, electrically conductive epoxy adhesive. Mix ratios for the adhesive are 4 to 1 by volume or 5 to 1 by weight.

Finite Element,Thermal Conductivity,Electronic Packaging,Finite Element Analysis,Heat Transfer,Interface Roughness,Thermal Expansion,Through Silicon Via,Conductive Adhesives,Conductive ...

polyurethane-based adhesive specifically designed for heat dissipation in battery pack assemblies. It perfectly tackles the challenge to balance thermal conductivity with high mechanical strength ...