Patterned wafer containing logic dies and 3D NAND memory dies, (f) X-ray ptychography, (g) THz wave-based defect inspection system, and (h) Coherent Fourier scatterometry techniques using ...

Their innovative technologies, including space alternated phase shift and timely energized bubble oscillation, aim to improve cleaning processes for both flat and 3D patterned wafers. With a focus ...

Photolithography uses light to transfer a pattern of features from a mask to a light-sensitive chemical photoresist on a semiconductor wafer. As the pattern is transferred, it is reduced in scale ...

Often CMP processes are applied between these depositions and patterning processing-steps to prevent dishing, remove excess materials, and maintain flatness and patterned wafer quality. CMP processes ...

It offers space alternated phase shift technology for flat and patterned wafer surfaces, which employs alternating phases of megasonic waves to deliver megasonic energy in a uniform manner on a ...

We propose solutions to these issues and establish a clear relationship between contact resistivity, series resistance, and ...