AZOM3 年
EVG®610 BA Bond Alignment System for Wafer-to-Wafer Alignment up to 200 mm
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AZOM3 年
EVG®620 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment
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Semiconductor Engineering29 天
Multi-Tier Die Stacking Enables Efficient Manufacturing
Alignment accuracy typically within ± 2 micrometers for both N=2 and N=3 stacks ... The multi-tier die stacking approach is scalable, allowing for the stacking of two, three, or even four dies in a ...