在封装技术不断升级迭代的过程中，出现了系统级封装(SiP)等新的封装方式。技术实现的方法包括 2.5D 封装(Interposer、RDL)、3D 封装(TSV)、倒装 FC(Flip Chip)、凸块(Bumping)、晶圆级封装 WLP(Wafer Level Package)、CoWoS (Chip onWafer on Substrate)、InFO (Integrated Fan-Out ...

公司是全球第三大、中国第一大封测厂。受益于半导体景气度回暖，公司24H1实现收入154.87亿元，同比+27.2%。其中，通讯电子占 ...

In the last three months, 4 analysts have published ratings on Amkor Tech AMKR, offering a diverse range of perspectives from ...

In a report released today, Steve Barger from KeyBanc initiated coverage with a Buy rating on Amkor (AMKR – Research Report) and a price ...

台积电已相继推出了基板上晶圆上的芯片（Chip on Wafer on Substrate ... 华天科技已掌握了 SiP、FC、TSV、Bumping、Fan-Out、WLP、3D 等集成电路先进封装技术。

在快节奏的工业自动化世界中，对能够跟上高速运行同时保持可靠性和安全性的组件的需求至关重要。这些系统中最关键的组件之一是光耦合器，它在机器的不同部分或机器之间传输信号时提供电气隔离。25MBd数字光耦合器的推出代表了该领域的重大进步，它不 ...

FOB China prices for N-type M10 and G12 wafers have remained stable this week at $0.140/pc and $0.198/pc, respectively, following a brief price increase driven by market leaders last week.

通用精密运算放大器评估板针对许多电路配置而设计并优化，以便用户能够找到适合其应用的设计。这些评估板都符合RoHs标准。参考下列引脚数和封装，决定需要订购的型号。 LTspice ® 是一款强大高效的免费仿真软件、原理图采集和波形观测器，为改善模拟电路 ...

Its services include design, package characterization, test, and wafer bumping services. The company was founded in 1968 and is headquartered in Tempe, AZ.

Use precise geolocation data. Actively scan device characteristics for identification. Store and/or access information on a ...