在封装技术不断升级迭代的过程中，出现了系统级封装(SiP)等新的封装方式。技术实现的方法包括 2.5D 封装(Interposer、RDL)、3D 封装(TSV)、倒装 FC(Flip Chip)、凸块(Bumping)、晶圆级封装 WLP(Wafer Level Package)、CoWoS (Chip onWafer on Substrate)、InFO (Integrated Fan-Out ...

台积电已相继推出了基板上晶圆上的芯片（Chip on Wafer on Substrate ... 华天科技已掌握了 SiP、FC、TSV、Bumping、Fan-Out、WLP、3D 等集成电路先进封装技术。

Cell companies, both in China and internationally, have so far shown limited acceptance of the recent wafer price hikes. The two leading wafer manufacturers managed to secure a slight increase of ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

A wafer that slowly releases painkilling medication as it dissolves inside the body could help recovery after knee replacement surgery. About the size of a 20p piece, the implant is sewn into the ...

Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected to begin ...

Those fans with tickets can't wait to see the rapid cars bump into each other at the Coliseum this weekend - but what are the ...

The takeover of the former Newport Wafer Fab factory has been cleared after years of uncertainty. MPs and ministers expressed deep national security concerns when the silicon chip plant was bought ...

Ireland back row Aoife Wafer has revealed that she turned down offers from English clubs in order to stay with Leinster. The 21-year-old was the breakout star of the Six Nations last spring and ...

Tony Boland, the former music director on the RTÉ show, on working with Gay Byrne and Bob Geldof, helping create the Self Aid telethon and setting up an annual festival celebrating one of music ...