Sub-second ALD cycle times enable fast and efficient exploration of applications that require thick films. The system covers difficult patterned substrates like advanced-generation DRAM device wafers, ...

However, the combination of high cost and small wafer size might limit the widespread application of this approach. So, in the absence of a reliable and cost-effective technique for coating 300-mm ...

Wafer and substrate processing steps can include thin polishing or chemical mechanical planarization, film deposition (PVD, CVD or electrodeposition), polishing, etching, patterning or lithography, ...