The system covers difficult patterned substrates like advanced-generation DRAM device wafers, sensors, membranes, electron multipliers, etc. with aspect ratios of up to 1,000. THEIA is best suited for ...

Wafer and substrate processing steps can include thin polishing or chemical mechanical planarization, film deposition (PVD, CVD or electrodeposition), polishing, etching, patterning or lithography, ...

In terms of the cell manufacturing process, uneven surfaces might occur during the texturing and coating process, and result in a slight decrease in cell efficiency. After adopting larger wafer ...

onto silicon wafers or other substrates. The precise thickness control and uniformity achieved by spin coating are crucial for the reliable performance of electronic devices. Spin coating is utilized ...

The EVG101 can be configured for spray or spin coating and developing while also supporting wafers up to 300 mm. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for ...

Products developed with these fluids show deep cut lines and divots, which are caused by ineffective swarf transport and degradation of the wire's diamond coating. This lowers wafer quality and ...