According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.

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The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...

“Four-point-bending (PB) tests were conducted on three thicknesses of G12 mono-Si wafers, and the load-displacement curves during the testing process were recorded.” This kind of testing is ...

Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...