Frontgrade Gaisler has launched its latest radiation-hardened microcontroller, the GR716B. Building on the success of the ...

Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and ...

Traditional interconnects have been unable to deliver the bandwidth, latency, and power efficiency needs of hyperscale data ...

Designers of aerospace and defense systems know that their applications are mission-critical and demand the highest levels of ...

HBM implementation challenges This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into ...

Eliyan today announced the successful tape out of its NuLink PHY in a x64 UCIe Advanced Package Module on Samsung Foundry’s SF4X 4nm advanced manufacturing process. Initial silicon for ...

FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power ...

PIX today announced that its innovative JPEG XS software technology now powers the support of JPEG XS VSF TR-07 within Grass ...

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system ...

TSMC is looking to introduce its A16 1.6nm process by the end of 2026 with an IEEE standard for its 3Dblox technology.

System-on-chip (SoC) designers face significant challenges when integrating thousands of IP blocks from various vendors, ...

Arteris and MIPS today announced a partnership to provide a pre-verified reference platform to support mutual customers. The ...