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有望彻底改变芯片封装!AMD收获玻璃基板专利:Intel、三星等都在布局
快科技11月28日消息,据媒体报道,AMD最近获得了玻璃基板技术专利(编号12080632),预计可能在未来几年内取代传统的有机基板,用于小芯片互连设计的处理器中。 这项发展可能会彻底改变芯片封装行业,因为它提供了比传统有机基板更优异的物理和光学特性 ...
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