搜索优化
English
搜索
Copilot
图片
视频
地图
资讯
购物
更多
航班
旅游
酒店
房地产
笔记本
Top stories
Sports
U.S.
Local
World
Science
Technology
Entertainment
Business
More
Politics
过去 30 天
时间不限
过去 1 小时
过去 24 小时
过去 7 天
按相关度排序
按时间排序
7 天
on MSN
有望彻底改变芯片封装!AMD收获玻璃基板专利:Intel、三星等都在布局
快科技11月28日消息,据媒体报道,AMD最近获得了玻璃基板技术专利(编号12080632),预计可能在未来几年内取代传统的有机基板,用于小芯片互连设计的处理器中。 这项发展可能会彻底改变芯片封装行业,因为它提供了比传统有机基板更优异的物理和光学特性 ...
一些您可能无法访问的结果已被隐去。
显示无法访问的结果
今日热点
Tsunami warnings lifted
Images of suspect released
May cut diabetes risk
Recuses himself from case
Set to return after 20 years
Billy Long to lead IRS
Nadler to step aside
Medellin cartel leader freed
DOJ: Bias against Blacks
Ethics report release blocked
Raw milk recall expands
SpaceX sets record
Social Security chief pick
Syrian rebels capture Hama
Recalls over 205,000 SUVs
Winter storm to hit US
Prenatal test spots cancer?
Airlines to pay for delays?
Tops $100K for the first time
Taiwan's pres visits Guam
$10B AI data center in LA
Rockefeller tree lights up
Satellites to create eclipses
US trade deficit shrinks
Airbus layoffs
New AI tools for employees
Weekly jobless claims rise
Delays oil output hike
Joins X Games as CEO
Jury deliberations continue
反馈