SAN RAMON, CA, UNITED STATES, December 5, 2024 -- YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution. Currently advanced packaging ...
“The core technology has already been proven in the MEMS market and eliminates expensive interposers, and we are planning on running test Chiplet packaging in 2025,” said Digitho CEO and founder, ...