The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence and ...
They have also become a major venue for increasing transistor density as Moore’s Law slows down. IDTechEx report “Chiplet Technology 2025-2035: Technology, Opportunities, Applications” asserts that ...
But there is an underlying tug-of-war underway between large, vertically integrated players that want to tightly define the socket specifications for chiplets, and a broad swath of startups, systems ...