12月1日消息，据韩媒The Elec报导，苹果公司已向台积电订购用于iPad Pro和Mac的M5芯片，该芯片采用先进Arm构架和台积电3nm制程。虽然M4芯片也采采用3nm制造，但新芯片将带来额外的性能提升，量产计划将于2025年下半年 ...

The Banana Pi BPI-CanMV-K230D-Zero is a compact and low-power single-board computer built around the Kendryte K230D dual-core XuanTie C908 RISC-V chip with an integrated third-generation Knowledge ...

and potentially a temperature sensor on the nRF9151 and a different charging IC. So I asked Conexio, and they replied both devkits were essentially the same, but the nRF9151 devkit is cheaper: Module ...

Boards with this chipset can feature either an Intel Pentium processor or VIA processor on front side bus (FSB ... Data Bus Routing Topology The data bus topology used in this design is ...

在人工智能、5G通信、物联网等新兴技术蓬勃发展的当下，EDA/IP与IC设计技术正迎来新一轮的变革与机遇··· 在人工智能、5G ...