台积电董事长魏哲家表示，尽管其公司在过去一年中将CoWoS的产能提升了超过两倍，但需求仍远超供应。这一现象尤为突出，因为人工智能领域的快速发展对计算能力的要求日益增加，而高性能的AI芯片往往依赖于先进的封装技术来提升其性能。中信证券进一步指出，先进封装技术已成为推动AI底层技术发展的重要方向，并且当前正处于全球市场的产能瓶颈之中。

在人工智能（AI）和高性能计算（HPC）日益成为市场主流的背景下，先进封装技术的重要性愈发凸显。根据台积电董事长魏哲家的透露，CoWoS的需求远超供应，尽管台积电已经将CoWoS的产能提升超过两倍，但仍面临供不应求的局面。这一现象为市场提供了丰富的想象空间，并引发了对于封装行业未来走向的深思。

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