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来自MSN
2 天
芯联集成:公司SiCMOSFET和12英寸硅基晶圆等新产品在头部客户快速 ...
每经AI快讯,11月27日,芯联集成在互动平台表示,受益于新能源车及消费市场的回暖,公司产能利用率逐步提升。公司SiC MOSFET、12英寸硅基晶圆等新产品在头部客户快速导入和量产,以SiC ...
国际电子商情
29 天
SiC器件“上车”新进展:国产力量崛起推动汽车电子革新
XzSesmc 现如今,新能源汽车主驱采用的主流器件,仍以750V、1200V SiC MOSFET为主。在当前的400V电压平台上,车厂开始采用750V的SiC器件来替代传统的Si器件,以提升系统的性能和效率。这种转变是新能源汽车主驱动系统大规模应用的关键,因为它满足了对于更高性能 ...
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