在半导体封装领域，Bumping（凸块）技术和Reflow（回流）工艺是连接芯片与外部电路的关键工艺。特别是在8寸Wafer的封装中，Bumping Reflow工艺显得尤为重要。本文将详细介绍半导体8寸Wafer的Bumping Reflow工艺特点，包括其基本原理、工艺流程、技术挑战及市场应用。

As AI and 5G networks expand rapidly, semiconductor companies are positioned to lead the next wave of technological innovation. Therefore, investors could consider adding shares of semiconductor ...

Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand ...

Net profit attributable to owners of the parent was RMB 0.46 billion. Net profit attributable to owners of the parent after ...

Amkor Technology, Inc. engages in the provision of outsourced semiconductor packaging and test services. Its services include design, package characterization, test, and wafer bumping services. The ...

R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

D.A. Davidson analyst Thomas Diffely maintained a Buy rating on Amkor (AMKR – Research Report) today. The company’s shares closed ...

In a report released today, Joseph Moore from Morgan Stanley maintained a Hold rating on Amkor (AMKR – Research Report), with a price ...

About JCET Group JCET Group is the world's leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package ...

TrendForce reveals that HBM5 20hi stack products will adopt hybrid bonding technology by 2025, which could transform DRAM industry's business models ...