Semiconductor company Infineon (IFNNY) unveiled its new silicon power wafer this week that it says is the “world’s thinnest.” The new silicon wafers, which were developed for AI data centers ...

Notably, beyond AWS, Intel added two 18A wafer design wins during the quarter from compute centric companies. Intel expects its first external customer to launch their 18A design in the first half ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

Following the news on the first 300mm GaN wafer, and the launch of the fab for 200mm SiC in Malaysia, Infineon revealed a few days ago another semiconductor manufacturing technological breakthrough ...

With an investment of US$900 million, Corning plans to build a solar wafer manufacturing plant in the US state of Michigan. Image: Corning. Glass and ceramics material manufacturer Corning has ...

Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer and the ...

Company first to master handling and processing of ultra-thin 20µm power semiconductor wafers Infineon has announced a breakthrough in handling and processing the thinnest silicon power wafers, with a ...

Solar Power World has confirmed that in addition to increased polysilicon production for the solar market, the companies in Hemlock, Michigan, will soon manufacture silicon ingots and wafers for solar ...

Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...

Infineon is the first semiconductor manufacturer to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers. Infineon Technologies AG has disclosed the subsequent ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...