Wafer and thin film instrumentation consists of devices such as critical defect scanning electron microscopes (CD-SEMs), ion mills, quartz crystal microbalance (QCM) monitors, RHEED systems, ...

The silicon wafers are also half as thick as current advanced wafers. “The new ultra-thin wafer technology drives our ambition to power different AI server configurations from grid to core in ...

The company will display the new ultra-thin silicon wafer for the first time at the electronica 2024 trade show in Munich. Infineon said the ultra-thin cut of silicon can reduce substrate ...

In a closely contested election, Mohammad Ismail Abdul Khalique of the All India Majlis-e-Ittehadul Muslimeen (AIMIM) has ...