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半导体晶圆激光切割技术大盘点!
在集成电路芯片的制造过程中,晶圆切割是至关重要的一步,其质量直接影响到芯片的最终性能。 随着摩尔定律的推进,半导体晶圆的厚度逐渐减小,导致其脆性增加,使得在切割过程中更容易出现破裂。此外,现代集成电路制造中引入了许多新材料,如低k ...
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