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  1. 再聊Intel 4工艺和Foveros封装:电脑CPU真的变了-电子工程专辑

  2. A Stacked CPU: Intel’s Foveros - The Intel Lakefield Deep Dive ...

  3. Intel Details 3D Chip Packaging Tech for Meteor Lake, Arrow Lake …

  4. Intel's LEGO-Like Chiplet Design For Next-Gen Meteor Lake ... - Wccftech

  5. Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts ...

  6. 处理和封装:英特尔技术革新的六大支柱

  7. Intel's new 3D Foveros packaging tech: LEGO-like chiplets

  8. 小芯片(Chiplet)| 助力您的小芯片创新 - 英特尔

  9. Foveros: Inside Intel’s new ‘chiplet’ 3D packaging technology