Semiconductor Packaging News
网页Semiconductor Engineering. ASML needs license for some services in China. The Dutch government now requires ASML Holding NV to obtain licenses for servicing chipmaking equipment sold to China, including spare parts and software. New restrictions begin on Sept. 6, expanding to ASML’s 1980di and 1970di machines.
Semiconductor Packaging News Index
网页Semiconductor Engineering. Sep 20, 2024. SUMMARY. Advanced Packaging Drives New Memory Solutions for the AI Era. AI is fueling demand for more computing power and advanced memory technologies like High-Bandwidth Memory (HBM). Lam Research, a leader ... EE Times. Sep 20, 2024. SUMMARY.
Semiconductor Packaging News
网页The semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Semiconductor Packaging News
网页Broadcom says it will sell $12 billion in AI parts and custom chips this year. Broadcom exceeded Wall Street's third-quarter expectations for revenue and earnings, but a $1.88 billion net loss from a tax provision led to a 7% drop in shares. Despite strong AI and semiconductor sales, revenue guidance met expectations at $14 billion.
More than 30 Projects, Overview of China's Semiconductor …
网页6 天之前 · In 2024, the semiconductor industry is bouncing back, driven by growing downstream demand. Over 30 projects in AI, chip design, and third-gen semiconductors are advancing, with AI boosting revenue and silicon carbide gaining traction in automotive and renewable energy. The dedicated team at Semiconductor Packaging News has …
Semiconductor Packaging News Technical Paper Index
网页Jul 31, 2024. Advanced Packaging for Next-Generation Vehicle. Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ... Amkor Technology, Inc. Jul 24, 2024. The Role of Solder in Advanced Semiconductor Packaging.
Semiconductor Packaging News
网页Chiplet Standard Goes 3D The UCIe Consortium has unveiled its 2.0 specs, revolutionizing chiplet technology with 3D packaging support. The update enhances bandwidth density, power efficiency, security & interoperability, paving the way for optimized 3D chiplet stacking & improved manageability.
TSMC Begins Small-Scale Production in Arizona for Apple's A16 …
网页3 天之前 · TSMC's Arizona fab has started trial production of Apple's A16 chip using the 5nm N4P process, a significant milestone. Tim Culpan reports the facility aims to scale up once Phase 1 is complete, with mass production set for 2025. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
Samsung automating semiconductor packaging, doubling efficiency
网页Samsung automating semiconductor packaging, doubling efficiency. Samsung accelerates IC manufacturing with advanced packaging automation, aiming to enhance production efficiency. The tech giant has announced plans to implement cutting-edge automation technologies in its chip manufacturing process, streamlining operations …
TSMC Explores Radical New Chip Packaging Approach to Feed AI …
网页TSMC Explores Radical New Chip Packaging Approach to Feed AI Boom. Summary. Taiwan Semiconductor Manufacturing Co. is developing an advanced chip packaging method to meet AI-driven computing power demands. Collaborating with equipment and material suppliers, TSMC's new method could take several years to commercialize, insiders reveal. Nikkei Asia.