LOCTITE® ECCOBOND UF 1173 - Henkel Adhesives
LOCTITE ECCOBOND UF 1173 is a one-part, void-free, second level epoxy underfill for encapsulating electronic packages. It enhances solder joint reliability, has a long pot life and low CTE, and is suitable for CSP and BGA applications.
LOCTITE® ECCOBOND UF 1173 - Henkel Adhesives
When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173™. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages.
LOCTITE ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability and distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages.
Loctite Eccobond UF 1173 | SVHC Free Board level underfill
LOCTITE® ECCOBOND UF 1173: Single-component underfill for maximizing temperature cycling in CSP & BGA packages. Fast curing, void-free, protects from shock/drop/vibration. High Tg (155°C), low CTE, REACH & CMR compliant.
Henkel’s new underfill formulation, LOCTITE® ECCOBOND® UF 1173, safeguards fine-pitch array devices such as BGAs and CSPs in a formulation that can withstand the high operating temperatures induced by smaller, higher-functioning devices within harsh environments.
ECCOBOND UF 1173 Epoxy Underfill, 55cc Syringe - TEquipment
When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages.
Henkel Loctite Eccobond UF 1173 - Gluespec
Henkel Loctite Eccobond UF 1173 is a 1-Part Heat cure, Epoxy, Liquid used to Encapsulant underfill . View datasheet for Henkel Loctite Eccobond UF 1173.
LOCTITE ECCOBOND UF 1173 - conro.com
LOCTITE ECCOBOND UF 1173 is an epoxy-based, single-component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages.
2420246 Loctite | Mouser
2024年10月8日 · 2420246 Loctite Chemicals Underfill, 55CC Plastic Syringe, LOCTITE Eccobond UF 1173 Series datasheet, inventory, & pricing.